THERMOCOMPRESSION BONDING APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT

To provide a thermocompression bonding apparatus capable of satisfactorily thermocompressing a plurality of thermocompression-bonding scheduled portions at the same time, and a manufacturing method of an electronic component including a step of thermocompression bonding using the thermocompression bonding apparatus.SOLUTION: A thermocompression bonding apparatus includes a stage section 10 having a placement surface 12 on which a part 20 having a thermocompression-bonding scheduled portion to be thermocompression-bonded is installed and a heater chip 4 that is disposed so as to be movable toward and away from the thermocompression-bonded portion of the part 20 positioned on the side opposite to the placement surface 12 of the stage section 10 and that can heat and press the thermocompression-bonding scheduled portion. The placement surface 12 has a maximum convex portion 12a in contact with the bottom surface of the part 20 and a pair of gentle inclined surfaces 12b the heights of which gradually decrease from the maximum convex portion 12a toward both sides in the Y axis direction.SELECTED DRAWING: Figure 4B 【課題】複数の熱圧着予定部を同時に良好に熱圧着することができる熱圧着装置と、それを用いて熱圧着を行う工程を含む電子部品の製造方法とを提供すること。【解決手段】熱圧着対象となる熱圧着予定部を持つ部品２０が設置される載置面１２を持つステージ部１０と、ステージ部１０の載置面１２と反対側に位置する部品２０の熱圧着予定部に向けて接近および離反移動自在に配置され、熱圧着予定部を加熱してプレスすることが可能なヒータチップ４と、を有する熱圧着装置である。載置面１２が、部品２０の底面に接触する最大凸部１２ａと、最大凸部１２ａからＹ軸方向の両側に向けて高さがそれぞれ徐々に小さくなる一対の緩傾斜面１２ｂと、を有する。【選択図】図４Ｂ