METHOD FOR MANUFACTURING SUBSTRATE JOINT, METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD, SUBSTRATE JOINT, AND LIQUID DISCHARGE HEAD
To provide a method for manufacturing a substrate joint that enables substrates to be aligned with a high degree of accuracy.SOLUTION: A method for manufacturing a substrate joint includes: a first joining step of joining first joining areas 121a and 121b of a first substrate 131 and third joining a...
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Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a method for manufacturing a substrate joint that enables substrates to be aligned with a high degree of accuracy.SOLUTION: A method for manufacturing a substrate joint includes: a first joining step of joining first joining areas 121a and 121b of a first substrate 131 and third joining areas 123a and 123b of a second substrate 132 at a first temperature; and a second joining step of joining a second joining area 122 of the first substrate 131 and a fourth joining area 124 of the second substrate 132 at a second temperature, after the first joining step. Characteristically, the first temperature is lower than the second temperature.SELECTED DRAWING: Figure 1
【課題】基板どうしの位置合わせを精度よく行うことができる基板接合体の製造方法を提供する。【解決手段】第一の基板131の第一の接合領域121a、121bと第二の基板132の第三の接合領域123a、123bとを第一の温度で接合する第一の接合工程と、第一の接合工程の後、第一の基板131の第二の接合領域122と第二の基板132の第四の接合領域124とを第二の温度で接合する第二の接合工程と、を含み、第一の温度は第二の温度よりも低いことを特徴とする基板接合体の製造方法。【選択図】図1 |
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