LEAD-FREE SOLDER ALLOY

To provide a lead-free solder alloy excellent in tensile strength and ductility, hardly generating breakage, even when especially low-speed stress is applied repeatedly, and having solidus line temperature/liquidus line temperature of a fixed value or lower.SOLUTION: A lead-free solder alloy contain...

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Bibliographische Detailangaben
Hauptverfasser:	OKUMURA SATOSHI, MATSUMURA MITSUHIRO, ICHIKAWA DAIGO, IWABUCHI MITSURU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	To provide a lead-free solder alloy excellent in tensile strength and ductility, hardly generating breakage, even when especially low-speed stress is applied repeatedly, and having solidus line temperature/liquidus line temperature of a fixed value or lower.SOLUTION: A lead-free solder alloy contains Bi as much as 40 mass% or more and 65 mass% or less, and Ag as much as more than 0 mass% and less than 1 mass%, and has a residue comprising Sn.SELECTED DRAWING: Figure 1 【課題】引張強度及び延性に優れ、特に低速での応力を繰り返し与えられた場合にも破断が生じ難く、また一定以下の固相線温度・液相線温度を有し得る鉛フリーはんだ合金の提供。【解決手段】Ｂｉを４０質量％以上６５質量％以下と、Ａｇを０質量％超１質量％未満含み、残部がＳｎからなることを特徴とする鉛フリーはんだ合金。【選択図】図１