LASER PROCESSING METHOD

To form a hole that hardly causes a conductive treatment failure by laser processing.SOLUTION: A laser processing method forms a hole 11 in a liquid crystal panel 1 by radiating a pulse laser beam 2 to the liquid crystal panel 1 including glass plates 3, 4. The laser processing method controls an am...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ITO SHO, HITAI YOJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To form a hole that hardly causes a conductive treatment failure by laser processing.SOLUTION: A laser processing method forms a hole 11 in a liquid crystal panel 1 by radiating a pulse laser beam 2 to the liquid crystal panel 1 including glass plates 3, 4. The laser processing method controls an amount of adherent matter X constituted of a molten scattering matter Y at a wall surface of the hole 11 while imaging a formation position of the hole 11 by a camera 12 through an end surface of the liquid crystal panel 1, in the step of forming the hole 11.SELECTED DRAWING: Figure 1 【課題】レーザー加工により、導電処理不良が生じにくい穴を形成する。【解決手段】ガラス板３，４を含む液晶パネル１にパルスレーザー２を照射することで、液晶パネル１に穴１１を形成するレーザー加工方法であって、穴１１の形成過程において、液晶パネル１の端面を通じて穴１１の形成位置をカメラ１２で撮影しながら、穴１１の壁面における溶融飛散物Ｙからなる付着物Ｘの量を制御する。【選択図】図１