PLASMA CUTTING DEVICE AND METHOD

To cut even a cutting object having painting applied onto a front surface and a rear surface, concerning a plasma cutting device and a method.SOLUTION: A plasma cutting device 1 for cutting a cutting object W having painting P1, P2 applied onto a front surface W1 and a rear surface W2 is provided wi...

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Bibliographische Detailangaben
Hauptverfasser: MASUZAKI TOSHIFUMI, NISHITSUJI YUTAKA, KUROMI YOSHIO
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To cut even a cutting object having painting applied onto a front surface and a rear surface, concerning a plasma cutting device and a method.SOLUTION: A plasma cutting device 1 for cutting a cutting object W having painting P1, P2 applied onto a front surface W1 and a rear surface W2 is provided with a plasma generator 11 for generating a plasma arc A toward the front surface W1 of the cutting object W, a painting removal device 12 for removing painting P2 on the rear surface W2 of the cutting object W, and a mobile device 13 for moving the plasma generator 11 and the painting removal device 12 along a cutting direction F of the cutting object W.SELECTED DRAWING: Figure 1 【課題】プラズマ切断装置及び方法において、表面及び裏面に塗装が施されている切断対象物であっても切断可能とする。【解決手段】表面W1及び裏面W2に塗装P1,P2が施された切断対象物Wを切断するプラズマ切断装置1であって、切断対象物Wの表面W1に向けてプラズマアークAを発生させるプラズマ発生装置11と、切断対象物Wの裏面W2の塗装P2を除去する塗装除去装置12と、プラズマ発生装置11及び塗装除去装置12を切断対象物Wの切断方向Fに沿って移動させる移動装置13とを設ける。【選択図】図1