RESIN COMPOSITION LAYER
PROBLEM TO BE SOLVED: To provide a resin composition layer capable of obtaining an insulating layer which can suppress a haloing phenomenon even when a thickness is thin and can form a via hole having a good shape.SOLUTION: A resin composition layer has a thickness of 15 μm or less, and contains (A)...
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| creator | WATANABE MASATOSHI TSURUI KAZUHIKO |
| description | PROBLEM TO BE SOLVED: To provide a resin composition layer capable of obtaining an insulating layer which can suppress a haloing phenomenon even when a thickness is thin and can form a via hole having a good shape.SOLUTION: A resin composition layer has a thickness of 15 μm or less, and contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler having an average particle diameter of 100 nm or less, and (D) a compound represented by formula (1): XSi(OR)or formula (2): (RO)Si-Z-Si(OR). In formula (1), X represents a monovalent aliphatic hydrocarbon group; Rrepresents a hydrogen atom or a monovalent aliphatic hydrocarbon group having 1 to 3 carbon atoms; m and n represent integers satisfying 1≤m≤3, 1≤n≤3 and m+n=4; Z represents a divalent aliphatic hydrocarbon group; Rrepresents a hydrogen atom or a monovalent aliphatic hydrocarbon group having 1 to 3 carbon atoms; and Rrepresents a hydrogen atom or a monovalent aliphatic hydrocarbon group having 1 to 3 carbon atoms.SELECTED DRAWING: Figure 1
【課題】厚みが薄くてもハローイング現象を抑制でき且つ良好な形状のビアホールの形成が可能な絶縁層を得られる樹脂組成物層を提供する。【解決手段】厚み１５μｍ以下の樹脂組成物層であって、（Ａ）エポキシ樹脂、（Ｂ）硬化剤、（Ｃ）平均粒径１００ｎｍ以下の無機充填材、及び、（Ｄ）式（１）又は式（２）で表される化合物を含む。ＸｍＳｉ（ＯＲ１）ｎ（１）（Ｒ２Ｏ）３Ｓｉ−Ｚ−Ｓｉ（ＯＲ３）３（２）（Ｘは、１価の脂肪族炭化水素基を表し、Ｒ１は、水素原子又は炭素原子数１〜３の１価の脂肪族炭化水素基を表し、ｍ及びｎは１≦ｍ≦３、１≦ｎ≦３且つｍ＋ｎ＝４を満たす整数を表し、Ｚは２価の脂肪族炭化水素基を表し、Ｒ２は水素原子又は炭素原子数１〜３の１価の脂肪族炭化水素基を表し、Ｒ３は水素原子又は炭素原子数１〜３の１価の脂肪族炭化水素基を表す。【選択図】図１ |
| format | Patent |
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【課題】厚みが薄くてもハローイング現象を抑制でき且つ良好な形状のビアホールの形成が可能な絶縁層を得られる樹脂組成物層を提供する。【解決手段】厚み１５μｍ以下の樹脂組成物層であって、（Ａ）エポキシ樹脂、（Ｂ）硬化剤、（Ｃ）平均粒径１００ｎｍ以下の無機充填材、及び、（Ｄ）式（１）又は式（２）で表される化合物を含む。ＸｍＳｉ（ＯＲ１）ｎ（１）（Ｒ２Ｏ）３Ｓｉ−Ｚ−Ｓｉ（ＯＲ３）３（２）（Ｘは、１価の脂肪族炭化水素基を表し、Ｒ１は、水素原子又は炭素原子数１〜３の１価の脂肪族炭化水素基を表し、ｍ及びｎは１≦ｍ≦３、１≦ｎ≦３且つｍ＋ｎ＝４を満たす整数を表し、Ｚは２価の脂肪族炭化水素基を表し、Ｒ２は水素原子又は炭素原子数１〜３の１価の脂肪族炭化水素基を表し、Ｒ３は水素原子又は炭素原子数１〜３の１価の脂肪族炭化水素基を表す。【選択図】図１</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181129&DB=EPODOC&CC=JP&NR=2018188599A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181129&DB=EPODOC&CC=JP&NR=2018188599A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WATANABE MASATOSHI</creatorcontrib><creatorcontrib>TSURUI KAZUHIKO</creatorcontrib><title>RESIN COMPOSITION LAYER</title><description>PROBLEM TO BE SOLVED: To provide a resin composition layer capable of obtaining an insulating layer which can suppress a haloing phenomenon even when a thickness is thin and can form a via hole having a good shape.SOLUTION: A resin composition layer has a thickness of 15 μm or less, and contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler having an average particle diameter of 100 nm or less, and (D) a compound represented by formula (1): XSi(OR)or formula (2): (RO)Si-Z-Si(OR). In formula (1), X represents a monovalent aliphatic hydrocarbon group; Rrepresents a hydrogen atom or a monovalent aliphatic hydrocarbon group having 1 to 3 carbon atoms; m and n represent integers satisfying 1≤m≤3, 1≤n≤3 and m+n=4; Z represents a divalent aliphatic hydrocarbon group; Rrepresents a hydrogen atom or a monovalent aliphatic hydrocarbon group having 1 to 3 carbon atoms; and Rrepresents a hydrogen atom or a monovalent aliphatic hydrocarbon group having 1 to 3 carbon atoms.SELECTED DRAWING: Figure 1
【課題】厚みが薄くてもハローイング現象を抑制でき且つ良好な形状のビアホールの形成が可能な絶縁層を得られる樹脂組成物層を提供する。【解決手段】厚み１５μｍ以下の樹脂組成物層であって、（Ａ）エポキシ樹脂、（Ｂ）硬化剤、（Ｃ）平均粒径１００ｎｍ以下の無機充填材、及び、（Ｄ）式（１）又は式（２）で表される化合物を含む。ＸｍＳｉ（ＯＲ１）ｎ（１）（Ｒ２Ｏ）３Ｓｉ−Ｚ−Ｓｉ（ＯＲ３）３（２）（Ｘは、１価の脂肪族炭化水素基を表し、Ｒ１は、水素原子又は炭素原子数１〜３の１価の脂肪族炭化水素基を表し、ｍ及びｎは１≦ｍ≦３、１≦ｎ≦３且つｍ＋ｎ＝４を満たす整数を表し、Ｚは２価の脂肪族炭化水素基を表し、Ｒ２は水素原子又は炭素原子数１〜３の１価の脂肪族炭化水素基を表し、Ｒ３は水素原子又は炭素原子数１〜３の１価の脂肪族炭化水素基を表す。【選択図】図１</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAPcg329FNw9vcN8A_2DPH091PwcYx0DeJhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhhaGFhamlpaOxkQpAgAknyAq</recordid><startdate>20181129</startdate><enddate>20181129</enddate><creator>WATANABE MASATOSHI</creator><creator>TSURUI KAZUHIKO</creator><scope>EVB</scope></search><sort><creationdate>20181129</creationdate><title>RESIN COMPOSITION LAYER</title><author>WATANABE MASATOSHI ; TSURUI KAZUHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2018188599A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2018</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>WATANABE MASATOSHI</creatorcontrib><creatorcontrib>TSURUI KAZUHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WATANABE MASATOSHI</au><au>TSURUI KAZUHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN COMPOSITION LAYER</title><date>2018-11-29</date><risdate>2018</risdate><abstract>PROBLEM TO BE SOLVED: To provide a resin composition layer capable of obtaining an insulating layer which can suppress a haloing phenomenon even when a thickness is thin and can form a via hole having a good shape.SOLUTION: A resin composition layer has a thickness of 15 μm or less, and contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler having an average particle diameter of 100 nm or less, and (D) a compound represented by formula (1): XSi(OR)or formula (2): (RO)Si-Z-Si(OR). In formula (1), X represents a monovalent aliphatic hydrocarbon group; Rrepresents a hydrogen atom or a monovalent aliphatic hydrocarbon group having 1 to 3 carbon atoms; m and n represent integers satisfying 1≤m≤3, 1≤n≤3 and m+n=4; Z represents a divalent aliphatic hydrocarbon group; Rrepresents a hydrogen atom or a monovalent aliphatic hydrocarbon group having 1 to 3 carbon atoms; and Rrepresents a hydrogen atom or a monovalent aliphatic hydrocarbon group having 1 to 3 carbon atoms.SELECTED DRAWING: Figure 1
【課題】厚みが薄くてもハローイング現象を抑制でき且つ良好な形状のビアホールの形成が可能な絶縁層を得られる樹脂組成物層を提供する。【解決手段】厚み１５μｍ以下の樹脂組成物層であって、（Ａ）エポキシ樹脂、（Ｂ）硬化剤、（Ｃ）平均粒径１００ｎｍ以下の無機充填材、及び、（Ｄ）式（１）又は式（２）で表される化合物を含む。ＸｍＳｉ（ＯＲ１）ｎ（１）（Ｒ２Ｏ）３Ｓｉ−Ｚ−Ｓｉ（ＯＲ３）３（２）（Ｘは、１価の脂肪族炭化水素基を表し、Ｒ１は、水素原子又は炭素原子数１〜３の１価の脂肪族炭化水素基を表し、ｍ及びｎは１≦ｍ≦３、１≦ｎ≦３且つｍ＋ｎ＝４を満たす整数を表し、Ｚは２価の脂肪族炭化水素基を表し、Ｒ２は水素原子又は炭素原子数１〜３の１価の脂肪族炭化水素基を表し、Ｒ３は水素原子又は炭素原子数１〜３の１価の脂肪族炭化水素基を表す。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | RESIN COMPOSITION LAYER |
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