RESIN COMPOSITION LAYER

PROBLEM TO BE SOLVED: To provide a resin composition layer capable of obtaining an insulating layer which can suppress a haloing phenomenon even when a thickness is thin and can form a via hole having a good shape.SOLUTION: A resin composition layer has a thickness of 15 μm or less, and contains (A)...

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Bibliographische Detailangaben
Hauptverfasser: WATANABE MASATOSHI, TSURUI KAZUHIKO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a resin composition layer capable of obtaining an insulating layer which can suppress a haloing phenomenon even when a thickness is thin and can form a via hole having a good shape.SOLUTION: A resin composition layer has a thickness of 15 μm or less, and contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler having an average particle diameter of 100 nm or less, and (D) a compound represented by formula (1): XSi(OR)or formula (2): (RO)Si-Z-Si(OR). In formula (1), X represents a monovalent aliphatic hydrocarbon group; Rrepresents a hydrogen atom or a monovalent aliphatic hydrocarbon group having 1 to 3 carbon atoms; m and n represent integers satisfying 1≤m≤3, 1≤n≤3 and m+n=4; Z represents a divalent aliphatic hydrocarbon group; Rrepresents a hydrogen atom or a monovalent aliphatic hydrocarbon group having 1 to 3 carbon atoms; and Rrepresents a hydrogen atom or a monovalent aliphatic hydrocarbon group having 1 to 3 carbon atoms.SELECTED DRAWING: Figure 1 【課題】厚みが薄くてもハローイング現象を抑制でき且つ良好な形状のビアホールの形成が可能な絶縁層を得られる樹脂組成物層を提供する。【解決手段】厚み15μm以下の樹脂組成物層であって、(A)エポキシ樹脂、(B)硬化剤、(C)平均粒径100nm以下の無機充填材、及び、(D)式(1)又は式(2)で表される化合物を含む。XmSi(OR1)n(1)(R2O)3Si−Z−Si(OR3)3(2)(Xは、1価の脂肪族炭化水素基を表し、R1は、水素原子又は炭素原子数1〜3の1価の脂肪族炭化水素基を表し、m及びnは1≦m≦3、1≦n≦3且つm+n=4を満たす整数を表し、Zは2価の脂肪族炭化水素基を表し、R2は水素原子又は炭素原子数1〜3の1価の脂肪族炭化水素基を表し、R3は水素原子又は炭素原子数1〜3の1価の脂肪族炭化水素基を表す。【選択図】図1