METAL BLADE AND METHOD FOR MANUFACTURING METAL BLADE

PROBLEM TO BE SOLVED: To provide a metal blade that can smoothly cut off a substrate such as a semiconductor material while suppressing generation of a flaw and the like, and to provide a method for manufacturing a metal blade.SOLUTION: A metal blade rotating about an axis line includes: a metal bon...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HOSHI JUNJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GRINDING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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