METAL BLADE AND METHOD FOR MANUFACTURING METAL BLADE

PROBLEM TO BE SOLVED: To provide a metal blade that can smoothly cut off a substrate such as a semiconductor material while suppressing generation of a flaw and the like, and to provide a method for manufacturing a metal blade.SOLUTION: A metal blade rotating about an axis line includes: a metal bon...

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Bibliographische Detailangaben
1. Verfasser:	HOSHI JUNJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GRINDING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a metal blade that can smoothly cut off a substrate such as a semiconductor material while suppressing generation of a flaw and the like, and to provide a method for manufacturing a metal blade.SOLUTION: A metal blade rotating about an axis line includes: a metal bond phase 11; and a diamond super-abrasive grain 12 dispersed in the metal bond phase 11. Surfaces of both sides 11A, 11B in the axis line of the metal bond phase 11 are subject to satin finish.SELECTED DRAWING: Figure 3 【課題】半導体材料等の基板を傷つき等の発生を抑制しつつスムースに切断することが可能なメタルブレード及びメタルブレード製造方法を提供すること。【解決手段】軸線周りに回転されるメタルブレードであって、メタルボンド相１１と、前記メタルボンド相１１に分散されたダイヤモンド超砥粒１２とを備え、前記メタルボンド相１１の前記軸線方向における両側１１Ａ、１１Ｂの表面はなし地とされていることを特徴とする。【選択図】図３