POLISHING DEVICE AND SUBSTRATE PROCESSING DEVICE

PROBLEM TO BE SOLVED: To provide a polishing device which can reduce power usage of the entire device, and to provide a substrate processing device.SOLUTION: A polishing module 21 has: a polishing table 23 having a polishing pad 22 to which a substrate W is pressed; a motor 23a which rotates the pol...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	ISOKAWA HIDETATSU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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