POLISHING DEVICE AND SUBSTRATE PROCESSING DEVICE

PROBLEM TO BE SOLVED: To provide a polishing device which can reduce power usage of the entire device, and to provide a substrate processing device.SOLUTION: A polishing module 21 has: a polishing table 23 having a polishing pad 22 to which a substrate W is pressed; a motor 23a which rotates the polishing table 23; and a polishing pad temperature adjustment device 50 which supplies a liquid to the polishing pad 22 and adjusts a surface temperature of the polishing pad 22. The polishing pad temperature adjustment device 50 has: a liquid supply tank 53 which stores a liquid; and a heater 56 which heats the liquid. The polishing module 21 includes: a heat recovery device 60 which supplies a refrigerant to the motor 23a and recovers heat of the motor 23a; and a liquid supply device 70 which supplies the refrigerant, which recovers the heat of the motor 23a, to the liquid supply tank 53 as a liquid for adjusting the surface temperature of the polishing pad 22.SELECTED DRAWING: Figure 2 【課題】装置全体の電力使用量を抑えることができる研磨装置及び基板処理装置の提供。【解決手段】基板Ｗが押し付けられる研磨パッド２２を有する研磨テーブル２３と、研磨テーブル２３を回転させるモーター２３ａと、研磨パッド２２に液体を供給し、研磨パッド２２の表面温度を調整する研磨パッド温調装置５０と、を有する研磨モジュール２１であって、研磨パッド温調装置５０は、液体を貯溜する液体供給タンク５３と、液体を加熱するヒーター５６と、を有しており、モーター２３ａに冷媒を供給し、モーター２３ａの熱を回収する熱回収装置６０と、モーター２３ａの熱を回収した冷媒を、研磨パッド２２の表面温度を調整する液体として液体供給タンク５３に供給する液体供給装置７０と、を有する。【選択図】図２