SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To improve performance of semiconductor device.SOLUTION: A semiconductor device has a wire 12 being joined at multiple places of one joining surface SEt1 in an opening 13H1 formed in the insulation film of a semiconductor chip. The semiconductor device also has a sealant for se...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SATO YUKIHIRO, KIYOHARA TOSHINORI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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