SEALING MATERIAL COMPOSITION, SEALING MATERIAL COMPOSITION FOR SEMICONDUCTOR, AND FINE PARTICLE FOR SEALING MATERIAL

PROBLEM TO BE SOLVED: To provide a sealing material which has excellent dispersibility of fine particles to a binder, can adjust viscosity, and has excellent toughness (stress relaxation property), a sealing material composition also used for semiconductor application, and a fine particle suitable for a sealing material.SOLUTION: A sealing material composition contains a fine particle having at least a core, where the core of the fine particle contains an acrylic resin, a glass transition temperature (Tg) of the fine particle is 45°C or higher, and an average particle diameter of the fine particle is 0.05-1.20 μm. In the sealing material composition, preferably, the fine particle contained in the sealing material composition further has a shell, and the shell contains an acrylic resin or a silica compound. In the sealing material composition, preferably, glass transition temperatures (Tgand Tg) of the core and the shell are each independently 80°C or higher.SELECTED DRAWING: None 【課題】バインダーに対する微粒子の優れた分散性を有し、粘性を調整でき、優れた靱性（応力緩和性）を備える、封止材、特に、半導体用途においても使用できる封止材組成物、及び、封止材に適した微粒子の提供。【解決手段】少なくともコアを有する微粒子を含む、封止材組成物であって、前記微粒子のコアは、アクリル樹脂を含み、前記微粒子のガラス転移温度（Ｔｇ）は、４５℃以上であり、前記微粒子の平均粒子径が０．０５〜１．２０μｍである、封止材組成物。好ましくは、前記封止材組成物に含まれる微粒子が、更にシェルを有し、前記シェルがアクリル樹脂又はシリカ化合物を含む、封止材組成物。好ましくはコア及びシェルのガラス転移温度（Ｔｇｃ，Ｔｇｓ）が夫々独立に８０℃以上である封止材組成物。【選択図】なし