ELECTROSTATIC CHUCK
PROBLEM TO BE SOLVED: To provide an electrostatic chuck capable of stably supporting a wafer with a wafer supporting surface while forming a plurality of grooves for efficiently exhausting a gas staying between the wafer and the wafer supporting surface of the electrostatic chuck over a wide range o...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an electrostatic chuck capable of stably supporting a wafer with a wafer supporting surface while forming a plurality of grooves for efficiently exhausting a gas staying between the wafer and the wafer supporting surface of the electrostatic chuck over a wide range of the wafer supporting surface to outside.SOLUTION: An electrostatic chuck E has a wafer support surface S. A plurality of grooves, particularly radial grooves G1 and circumferential grooves G2 are formed on the wafer support surface S. The radial groove G1 and the circumferential groove G2 communicate with each other.SELECTED DRAWING: Figure 1
【課題】ウエハ支持面の広範囲にわたって、ウエハと静電チャックのウエハ支持面との間に滞留するガスを効率的に外部に排出する複数の溝を形成しつつ、ウエハをウエハ支持面で安定して支持することのできる静電チャックを提供する。【解決手段】静電チャックＥは、ウエハ支持面Ｓを有する。ウエハ支持面Ｓには、複数の溝、特に径方向の溝Ｇ１と周方向の溝Ｇ２が形成されていて、径方向の溝Ｇ１と周方向の溝Ｇ２が、互いに連通している。【選択図】図１ |
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