ELECTRONIC MODULE

PROBLEM TO BE SOLVED: To provide an electronic module which can avoid a damage on an electronic device and a breaking of a wiring pattern.SOLUTION: An electronic module comprises a flexible substrate 2 having an insulation quality; a circuit part 5 which has a wiring pattern 3 formed on at least one...

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Bibliographische Detailangaben
Hauptverfasser:	ISHIKAWA AKIRA, HONDA KENICHI, ISHIKAWA TSUTOMU, WATANUKI SETSU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electronic module which can avoid a damage on an electronic device and a breaking of a wiring pattern.SOLUTION: An electronic module comprises a flexible substrate 2 having an insulation quality; a circuit part 5 which has a wiring pattern 3 formed on at least one face of the substrate 2 on which at least one device of an optical device 4 and an electronic device is mounted; and a resin body 6 which seals the circuit part 5 with an insulated resin. The wiring pattern 3 is composed of a metal foil which can be soldered, and the metal foil is composed of a material having a melting point of a molding temperature or less at when sealing the circuit part 5 with the insulated resin.SELECTED DRAWING: Figure 1 【課題】電子デバイスにダメージを与えることや配線パターンの断線が発生することを回避することができる電子モジュールを提供する。【解決手段】柔軟性を有するとともに絶縁性を有する基材２と、該基材２の少なくとも一方の面上に形成される配線パターン３に光デバイス４及び電子デバイスのうちの少なくとも一方のデバイスが実装された回路部５と、該回路部５を絶縁性樹脂で封止する樹脂体６と、を備え、前記配線パターン３が、半田付けが可能な金属箔で構成され、該金属箔が、前記絶縁性樹脂で前記回路部５を封止する際の成形温度以下の融点を有する材料から構成されている。【選択図】図１