HEAT RADIATION STRUCTURE

PROBLEM TO BE SOLVED: To provide a technology that enables improvement in reliability of heat radiation for an electronic component.SOLUTION: A heat radiation structure 1 includes: an electronic substrate 2; an electronic component 3 mounted on the electronic substrate 2; a cover member 4 being a heat radiation member which emits heat generated by the electronic component 3; and heat conductor members 6 which are provided between the electronic component 3 and the cover member 4 while contacting with each of the electronic component 3 and the cover member 4 and conduct heat generated by the electronic component 3 to the cover member 4. Further, in the heat radiation structure 1, at least one of the electronic substrate 2, the electronic component 3, and the cover member 4 has a moving prevention part 11 which prevents the heat transmission members 6 from falling from a space S between the electronic component 3 and the cover member 4.SELECTED DRAWING: Figure 4 【課題】電子部品に対する放熱の信頼性を向上させることが可能な技術を提供する。【解決手段】放熱構造１は電子基板２と、電子基板２に実装される電子部品３と、電子部品３が発する熱を放出する放熱部材であるカバー部材４と、電子部品３とカバー部材４との間に各々に接触して設けられて電子部品３が発する熱をカバー部材４に伝達する熱伝達部材６と、を備える。さらに、放熱構造１は電子基板２、電子部品３、カバー部材４の少なくとも一つが、熱伝達部材６の、電子部品３とカバー部材４との間の空間Ｓからの脱落を阻止する移動阻止部１１を有する。【選択図】図４