SUBSTRATE MACHINING DEVICE, AND SUBSTRATE MACHINING METHOD

PROBLEM TO BE SOLVED: To provide a substrate machining device capable of detecting contact between a machining part and a substrate before machining of the substrate is advanced.SOLUTION: The substrate machining device is provided, including: a holding part that holds a substrate; a machining part that comes in contact with the substrate held by the holding part and machines the substrate; a driving part that rotates the machining part, and causes the machining part to come close to the substrate held by the holding part; a ring type periodic pattern part that rotates together with the machining part; a detection part that reads the periodic pattern of the periodic pattern part and outputs a pulse signal in accordance with the number of rotations of the periodic pattern part; a driving control part that controls the driving part; and a contact detection part that detects the contact of the substrate with the machining part on the basis of a period of the pulse signal output from the detection part when the driving control part causes the machining part to rotate and to come close to the substrate held by the holding part.SELECTED DRAWING: Figure 7 【課題】基板の加工が進む前に、基板に対する加工部の接触を検知できる、基板加工装置の提供。【解決手段】基板を保持する保持部と、前記保持部で保持されている前記基板に接触して前記基板を加工する加工部と、前記加工部を回転させると共に、前記加工部を前記保持部で保持されている前記基板に対し接近させる駆動部と、前記加工部と共に回転するリング状の周期パターン部と、前記周期パターン部の周期パターンを読み取って前記周期パターン部の回転数に応じたパルス信号を出力する検出部と、前記駆動部を制御する駆動制御部と、前記駆動制御部によって前記加工部を回転させると共に前記加工部を前記保持部で保持されている前記基板に対し接近させるとき、前記加工部と前記基板の接触を、前記検出部から出力されるパルス信号の周期に基づき検知する接触検知部とを有する、基板加工装置。【選択図】図７