SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

PROBLEM TO BE SOLVED: To suppress reduction of throughput.SOLUTION: A substrate processing device comprises a carrier mounting part, a lid opening/closing mechanism, a substrate mounting part, a first transfer device, multiple processing parts, a second transfer device and a control part. The lid opening/closing mechanism opens/closes a lid of a carrier that is mounted in the carrier mounting part. The first transfer device includes multiple substrate holding parts each holding a substrate and transfers multiple substrates between the carrier and the mounting part. In a state where the number of vacant mounting places where substrates are not mounted among multiple mounting places that the substrate mounting part includes is less than the number of substrates to be simultaneously transferred by the first transfer device and the lid is closed, from a time point in which it is determined to take substrates amount of the substrate mounting part by the second transfer device to a time point prior to an estimated time point in which it is estimated that the number of vacant mounting places reaches the number of substrates to be simultaneously transferred, the control part causes the lid opening/closing mechanism to start an opening operation for opening the lid.SELECTED DRAWING: Figure 8B 【課題】スループットの低下を抑制すること。【解決手段】実施形態に係る基板処理装置は、キャリア載置部、蓋体開閉機構、基板載置部、第１搬送装置、複数の処理部、第２搬送装置および制御部を備える。蓋体開閉機構は、キャリア載置部に載置されたキャリアの蓋体を開閉する。第１搬送装置は、基板を保持する複数の基板保持部を有し、キャリアと載置部との間で複数の基板を搬送する。制御部は、基板載置部が有する複数の載置場所のうち基板が載置されていない空き載置場所の数が、第１搬送装置によって同時搬送される基板の枚数未満であり、且つ、蓋体が閉じられた状態において、第２搬送装置により基板載置部から基板を取り出すことが決定された時点から空き載置場所の数が同時搬送される基板の枚数に達すると予想される予想時点よりも前の時点までの間に、蓋体開閉機構に対し、蓋体を開く開動作を開始させる。【選択図】図８Ｂ