INFRARED SENSOR DEVICE

PROBLEM TO BE SOLVED: To provide an infrared sensor device which can obtain a stable output without being affected by heat generation caused by operations of an amplifier circuit and can measure temperatures accurately, the infrared sensor device having a temperature detection element with an array...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: HISHINUMA KUNIYUKI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an infrared sensor device which can obtain a stable output without being affected by heat generation caused by operations of an amplifier circuit and can measure temperatures accurately, the infrared sensor device having a temperature detection element with an array structure.SOLUTION FOR THE PROBLEM: The infrared sensor device includes: an infrared detection unit 2 made of a thermopile element with the array structure; and an amplification unit 4 for amplifying the output of the infrared detection unit 2, on a silicon substrate 1. There is a metal film 7 on the silicon substrate 1, which does not exist below the infrared detection part 2 but exists below the amplification unit 4 and surrounds the infrared detection part 2 in a plane view. The distance from the infrared detection part 2 to the metal film 7 is set so that the distance X on the amplification unit 4 side is larger than the other distances Y, Y, Y.SELECTED DRAWING: Figure 1 【課題】増幅回路などの動作による発熱の影響を受けず、安定した出力を得ることができ、高精度な温度測定が可能な、アレイ構造の温度検出素子を有する赤外線センサ装置を提供する。【課題の解決手段】シリコン基板1上に、アレイ構造のサーモパイル素子からなる赤外線検出部2と、この赤外線検出部2の出力を増幅する増幅部4を備え、シリコン基板1上に設けた金属膜7を、増幅部4の下方には存在する一方、赤外線検出部2の下方には存在することなく平面視で赤外線検出部2を囲むように配置し、赤外線検出部2から金属膜7までの間隔を、増幅部4側の間隔Xが他の部分の間隔Y1,Y2,Y3よりも広くなるよう設定する。【選択図】図1