THERMALLY CONDUCTIVE FOAM SHEET

PROBLEM TO BE SOLVED: To provide a thermally conductive foam sheet having high thermal conductivity and a good surface state.SOLUTION: A thermally conductive foam sheet contains an elastomer resin (A), a thermally conductive filler (B), and an olefinic low-molecular-weight resin (C) with a weight av...

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Bibliographische Detailangaben
1. Verfasser:	TAKASU KENICHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a thermally conductive foam sheet having high thermal conductivity and a good surface state.SOLUTION: A thermally conductive foam sheet contains an elastomer resin (A), a thermally conductive filler (B), and an olefinic low-molecular-weight resin (C) with a weight average molecular weight of 900-50,000.SELECTED DRAWING: None 【課題】熱伝導率が高く、表面状態の良好な熱伝導性発泡体シートを提供することを課題とする。【解決手段】エラストマー樹脂（Ａ）、熱伝導性フィラー（Ｂ）、重量平均分子量が９００〜５０，０００のオレフィン系低分子量樹脂（Ｃ）を含有する熱伝導性発泡体シートである。【選択図】なし