SOLID SEALING MATERIAL FOR COMPRESSION MOLDING, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD

PROBLEM TO BE SOLVED: To provide a solid sealing material for a compression molding that has excellent stability of warpage behavior after molding and heat treatment, and a semiconductor device and a semiconductor device production method using the solid sealing material.SOLUTION: A solid sealing ma...

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Bibliographische Detailangaben
Hauptverfasser:	INABA TAKAKAZU, SEKI KOHEI, SUDO HIKARI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a solid sealing material for a compression molding that has excellent stability of warpage behavior after molding and heat treatment, and a semiconductor device and a semiconductor device production method using the solid sealing material.SOLUTION: A solid sealing material for a compression molding contains an epoxy resin, a curing agent, and an inorganic filler, where the epoxy resin contains an epoxy modified silicone compound with an epoxy equivalent of 1000 g/mol or more.SELECTED DRAWING: None 【課題】成形後及び熱処理後における反り挙動の安定性に優れる圧縮成形用の固形封止材、並びにこれを用いる半導体装置の製造方法及び半導体装置の提供。【解決手段】エポキシ樹脂と、硬化剤と、無機充填材と、を含有し、前記エポキシ樹脂が、エポキシ当量が１０００ｇ／ｍｏｌ以上であるエポキシ変性シリコーン化合物を含む、圧縮成形用固形封止材。【選択図】なし