COMPOUND, RESIN COMPOSITION, RESIN SHEET, RESIN CURED PRODUCT, RESIN SUBSTRATE, AND MULTILAYER SUBSTRATE

PROBLEM TO BE SOLVED: To provide a compound which is excellent in solubility in a solvent and compatibility with a curative, has high thermal conductivity, and provide a cured product with good heat resistance.SOLUTION: A compound has an epoxy group, a phenolic hydroxyl group, and a mesogen. A compo...

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Hauptverfasser:	INAGAKI TAKASHI, HAYAMA JUMPEI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON HETEROCYCLIC COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a compound which is excellent in solubility in a solvent and compatibility with a curative, has high thermal conductivity, and provide a cured product with good heat resistance.SOLUTION: A compound has an epoxy group, a phenolic hydroxyl group, and a mesogen. A compound has an epoxy group and one mesogen, where the mesogen preferably has one or more phenolic hydroxyl groups. Especially preferably, the compound is represented by the formula 13.SELECTED DRAWING: None 【課題】溶媒に対する溶解性および硬化剤との相溶性に優れ、熱伝導率が高く、耐熱性の良好な硬化物の得られる化合物の提供。【解決手段】エポキシ基と、フェノール性水酸基と、メソゲンとを有する化合物とする。化合物は、エポキシ基と、１つのメソゲンとを有し、前記メソゲンがフェノール性水酸基を１つ以上有することが好ましい。特に好ましくは式１３で示される化合物。【選択図】なし