SUSPENSION SUBSTRATE WITH CIRCUIT

PROBLEM TO BE SOLVED: To provide a suspension substrate with a circuit capable of sufficiently securing an adhesive area and preventing an adhesive from flowing out between a slider and a weir portion.SOLUTION: A suspension substrate with a circuit 1, on which a slider is mounted includes: a metal s...

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Bibliographische Detailangaben
Hauptverfasser: KANEZAKI SAORI, TANABE HIROYUKI, FUJIMURA HIROTO
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a suspension substrate with a circuit capable of sufficiently securing an adhesive area and preventing an adhesive from flowing out between a slider and a weir portion.SOLUTION: A suspension substrate with a circuit 1, on which a slider is mounted includes: a metal support layer 2; a base insulating layer 3; a conductor pattern 4 including a plurality of magnetic head connection terminals 40; a first cover insulating layer 5 for coating the conductor pattern 4 so that the plurality of magnetic head connection terminals 40 are exposed; and a second insulating cover layer 6. A weir portion 60 is formed which extends from the second insulating cover layer 6 so as to surround the adhesion region R and opens toward the plurality of magnetic head connecting terminals 40, to prevent an adhesive A from protruding from the adhesion region R, and a pedestal surface 62 is provided which is located on one side in a thickness direction with respect to the adhesion region R in one surface in the thickness direction of the weir portion 60 and is in contact with the slider.SELECTED DRAWING: Figure 1 【課題】接着領域を十分に確保できるとともに、スライダと堰部との間から接着剤が流出することを抑制できる回路付サスペンション基板を提供すること。【解決手段】スライダが実装される回路付サスペンション基板1に、金属支持層2と、ベース絶縁層3と、複数の磁気ヘッド接続端子40を含む導体パターン4と、複数の磁気ヘッド接続端子40が露出されるように導体パターン4を被覆する第1カバー絶縁層5と、第2カバー絶縁層6とを備える。第2カバー絶縁層6から、接着領域Rを囲むように延び、かつ、複数の磁気ヘッド接続端子40に向かって開放され、接着剤Aが接着領域Rからはみ出すことを抑制する堰部60を形成し、堰部60の厚み方向一方面に、接着領域Rよりも厚み方向の一方側に位置し、スライダと接触する台座面62を備える。【選択図】図1