EPOXY RESIN COMPOSITION, CURED PRODUCT AND ELECTRONIC COMPONENT DEVICE

PROBLEM TO BE SOLVED: To provide: an epoxy resin composition which has excellent flowability and causes little increase in viscosity over time; a cured product using the same; and an electronic component device including an element encapsulated with the cured product.SOLUTION: The epoxy resin compos...

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Bibliographische Detailangaben
Hauptverfasser:	INABA TAKAKAZU, SEKI KOHEI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide: an epoxy resin composition which has excellent flowability and causes little increase in viscosity over time; a cured product using the same; and an electronic component device including an element encapsulated with the cured product.SOLUTION: The epoxy resin composition comprises (a) an epoxy resin, (b) an acid anhydride based curative, (c) a curing accelerator, and (d) an inorganic filler. The curing accelerator (c) comprises (c-1) a salt comprising a phosphonium cation represented by the general formula (1-p) in the figure, where Rto Reach independently represent a C1-16 linear or branched alkyl group.SELECTED DRAWING: None 【課題】流動性に優れ、経時による粘度上昇が抑制されたエポキシ樹脂組成物、これを用いてなる硬化物及び硬化物を用いて封止された素子を備える電子部品装置の提供。【解決手段】（ａ）エポキシ樹脂、（ｂ）酸無水物系硬化剤、（ｃ）硬化促進剤及び（ｄ）無機充填材を含み、前記（ｃ）硬化促進剤は、（ｃ−１）下記一般式（１−ｐ）で表されるホスホニウムカチオンを含む塩を含むエポキシ樹脂組成物（一般式（１−ｐ）中、Ｒ１〜Ｒ４はそれぞれ独立に、炭素数１〜１６の直鎖状又は分岐鎖状のアルキル基を表す。）。【化１】【選択図】なし