PHOTOSENSITIVE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of bonding semiconductor elements to each other while maintaining patterning properties, and to provide a semiconductor device which includes a laminated semiconductor element obtained by bonding semiconductor elements to each other with the photosensitive resin composition, has high reliability, and is easy to manufacture.SOLUTION: The photosensitive resin composition contains (A) an alkali-soluble resin having a functional group exhibiting Bronsted acidity by proton dissociation, (B) a photoacid generator, (C) a thermal crosslinking agent, and (D) an alkoxysilane compound. The alkoxysilane compound (D) has an aromatic ring, and a functional group exhibiting reactivity with the functional group exhibiting Bronsted acidity by proton dissociation is directly bonded to the aromatic ring.SELECTED DRAWING: Figure 1 【課題】パターニング性を維持しつつ半導体素子同士を接着し得る感光性樹脂組成物、およびかかる感光性樹脂組成物により半導体素子同士を接着した積層型半導体素子を備え、信頼性が高く製造が容易な半導体装置を提供する。【解決手段】（Ａ）プロトン解離によりブレンステッド酸性を示す官能基を有するアルカリ可溶性樹脂と、（Ｂ）光酸発生剤と、（Ｃ）熱架橋剤と、（Ｄ）アルコキシシラン化合物とを含有する感光性樹脂組成物。（Ｄ）アルコキシシラン化合物は芳香環を有し、プロトン解離によりブレンステッド酸性を示す官能基と反応性を示す官能基が、芳香環に直接結合している。【選択図】図１