MANUFACTURING METHOD OF METAL-CERAMICS CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal-ceramics circuit board capable of promptly coating side faces of a metal circuit board while preventing the resin from being deposited on a top face of the metal circuit board when coating the mutually opposite side faces of adjacent circuit patterns of the metal circuit board with the resin in the metal-ceramics circuit board configured by bonding the metal circuit board to one surface of a ceramics substrate.SOLUTION: A ceramics substrate 10 in which a metal circuit board 12 in which an interval between bottoms of mutually opposite side faces of adjacent circuit patterns is 0.5 to 2.5 mm and depth is 0.2 to 1.0 mm is bonded to one surface is prepared. Along a straight line for which a ratio of a distance from a bottom of one side face with respect to the interval between the bottoms of the mutually opposite side faces of the adjacent circuit patterns of the metal circuit board is 0.5 to 0.6, a polyimide resin solution 14 of which the viscosity at an ordinary temperature is 50 to 1000 mPa s is dripped onto the one surface of the ceramics substrate for a drip amount of 0.2 to 1.2 mg per length of 1 mm of the straight line.SELECTED DRAWING: Figure 1 【課題】セラミックス基板の一方の面に金属回路板が接合した金属−セラミックス回路基板において、金属回路板の隣接する回路パターンの互いに対向する側面に樹脂を塗布する際に、金属回路板の上面への樹脂の付着を防止するとともに金属回路板の側面に迅速に樹脂を塗布することができる、金属−セラミックス回路基板の製造方法を提供する。【解決手段】隣接する回路パターンの互いに対向する側面の底部の間隔が０．５〜２．５ｍｍで厚さ０．２〜１．０ｍｍの金属回路板１２が一方の面に接合したセラミックス基板１０を用意し、金属回路板の隣接する回路パターンの互いに対向する側面の底部の間隔に対する一方の側面の底部からの距離の比が０．５〜０．６である直線に沿って、この直線の長さ１ｍｍ当たり０．２〜１．２ｍｇの滴下量で常温における粘度５０〜１０００ｍＰａ・ｓのポリイミド樹脂溶液１４をセラミックス基板の一方の面に滴下する。【選択図】図１