WIRING MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a wiring member having coupling parts which can be collectively connected to a plurality of conductive members while reducing wiring resistance and the like, and are deformable even after connection, a semiconductor device using the same, and a method for manufacturing the semiconductor device.SOLUTION: A wiring member has a plurality of connection parts 11 having one surfaces 11a, surfaces 12a, and coupling parts 12 which are integrated with two adjacent connection parts out of the plurality of connection parts and electrically connects the connection parts, where a thickness in a normal direction of the surface of the coupling parts 12 is thinner than a thickness in a normal direction of one surface of the connection parts. Thereby, rigidity of the coupling part is lowered, the coupling part can be collectively connected to a plurality of conductive members while reducing wiring resistance and the like, and the coupling part becomes a deformable wiring member even after connected to the conductive member. A semiconductor device in which positional deviation of the plurality of conductive members is suppressed manufactured with the use of the wiring part. The manufacturing method includes deforming the coupling parts with a molding pressure with a resin material after connection with the wiring member.SELECTED DRAWING: Figure 3 【課題】配線抵抗等を低減しつつ、複数の導電性部材と一括接続でき、接続後でも変形可能な連結部を備える配線部材およびこれを用いた半導体装置並びに該半導体装置の製造方法を実現する。【解決手段】一面１１ａを有する複数の接続部１１と、表面１２ａを有し、該複数の接続部のうち隣接する２つの該接続部と一体化され、これらを電気的に接続する連結部１２と、を備え、連結部１２の該表面の法線方向における厚みを、該接続部の一面の法線方向における厚みよりも薄い配線部材とする。これにより、該連結部の剛性が低下し、配線抵抗等を低減しつつも、複数の導電性部材と一括接続でき、導電性部材に接続された後であっても、該連結部が変形可能な配線部材となる。また、該配線部材を用いることで、該複数の導電性部材の位置ズレが抑制された半導体装置となる。この製造方法は、該配線部材を接続後に、樹脂材料による成形圧で連結部を変形することを含む。【選択図】図３