HOT-MELT ADHESIVE FOR LAMINATE AND LAMINATED FILM LAMINATE USING THE SAME

PROBLEM TO BE SOLVED: To provide a hot-melt adhesive that has sufficient laminate strength on e.g. a polypropylene film, and is excellent in transparency, even application and the like, and a laminated film laminate using the same.SOLUTION: The problem is solved by a hot-melt adhesive for laminate c...

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Bibliographische Detailangaben
1. Verfasser:	KUBOTA IKUO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a hot-melt adhesive that has sufficient laminate strength on e.g. a polypropylene film, and is excellent in transparency, even application and the like, and a laminated film laminate using the same.SOLUTION: The problem is solved by a hot-melt adhesive for laminate containing an ethylene-propylene copolymer (A) 20-70 mass%, a hydrogenated tackifier resin (B) 20-55 mass%, and a wax (D) with a melting point of 120-160°C of 1-10 mass%, and a laminated film laminate using the hot-melt adhesive for laminate.SELECTED DRAWING: None 【課題】本発明の目的は、ポリプロピレンフィルム等に対して十分なラミネート強度を有し、かつ透明性、塗布ムラ等に優れたホットメルト接着剤及びそれを用いたラミネートフィルム積層体を提供することである。【解決手段】上記課題は、エチレン−プロピレンコポリマー（Ａ）２０〜７０質量％、水添粘着付与樹脂（Ｂ）２０〜５５質量％、及び、融点が１２０〜１６０℃のワックス（Ｄ）１〜１０質量％を含むラミネート用ホットメルト接着剤及び該ラミネート用ホットメルト接着剤を用いてなるラミネートフィルム積層体によって解決される。【選択図】なし