TEMPLATE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a template which suppresses charging during imprint processing and which can obtain a desired intensity of an alignment signal at the time of alignment even after template cleaning.SOLUTION: In an embodiment, there is provided a template that includes a template subs...

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1. Verfasser:	KOMUKAI TOSHIAKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a template which suppresses charging during imprint processing and which can obtain a desired intensity of an alignment signal at the time of alignment even after template cleaning.SOLUTION: In an embodiment, there is provided a template that includes a template substrate 11, and a device forming pattern 22 and an alignment mark provided on the same surface of the template substrate 11. The alignment mark has a refraction layer 54 provided at the bottom of a first concave pattern provided on the template substrate 11 and an insulating layer 56 in which the first concave pattern provided with the refraction layer 54 is buried.SELECTED DRAWING: Figure 4 【課題】インプリント処理中の帯電を抑制し、またテンプレートの洗浄後も位置合わせ時に所望のアライメント信号の強度を得ることができるテンプレートを提供する。【解決手段】実施形態によれば、テンプレート基板１１と、テンプレート基板１１の同一面に設けられるデバイス形成パターン２２およびアライメントマークと、を備えるテンプレートが提供される。アライメントマークは、テンプレート基板１１に設けられた第１凹パターンの底部に設けられる屈折層５４と、屈折層５４が設けられた第１凹パターンを埋め込む絶縁層５６と、を有する。【選択図】図４