LAMINATE WITH ADHESIVE LAYER, AND FLEXIBLE COPPER-CLAD LAMINATE PLATE AND FLEXIBLE FLAT CABLE USING THE SAME

PROBLEM TO BE SOLVED: To provide a laminate with an adhesive layer having high adhesion to a base material film made of a polyimide resin or the like and a copper foil and excellent electric characteristics, and to provide the laminate with the adhesive layer, where warpage of the laminate is less w...

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA SHIGEJI, OKIMURA YUYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS AS ADHESIVES
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