LAMINATE WITH ADHESIVE LAYER, AND FLEXIBLE COPPER-CLAD LAMINATE PLATE AND FLEXIBLE FLAT CABLE USING THE SAME
PROBLEM TO BE SOLVED: To provide a laminate with an adhesive layer having high adhesion to a base material film made of a polyimide resin or the like and a copper foil and excellent electric characteristics, and to provide the laminate with the adhesive layer, where warpage of the laminate is less w...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a laminate with an adhesive layer having high adhesion to a base material film made of a polyimide resin or the like and a copper foil and excellent electric characteristics, and to provide the laminate with the adhesive layer, where warpage of the laminate is less when the adhesive layer is in a stage B, and storage stability of the laminate is excellent.SOLUTION: A laminate with an adhesive layer has a base material film, and an adhesive layer on at least one surface of the base material film, where the adhesive layer is made of an adhesive composition containing predetermined amounts of a carboxyl group-containing styrenic elastomer (A) and an epoxy resin (B) and is in a stage B, a thickness of the adhesive layer is thicker than a thickness of the base material film, and when the laminate with the adhesive layer having a square shape is laid on a horizontal plane with the side the adhesive layer up, a ratio (H/L) of a floating height (H) of the end of the laminate to a length (L) of one side of the laminate is less than 0.05.SELECTED DRAWING: None
【課題】ポリイミド樹脂等からなる基材フィルムや銅箔に対する高い接着性、及び優れた電気特性を有する接着剤層付き積層体を提供する。また、接着剤層がBステージ状のときの積層体の反りが少なく、積層体の貯蔵安定性も良好な接着剤層付き積層体を提供する。【解決手段】基材フィルムと、該基材フィルムの少なくとも一方の表面に接着剤層とを備える接着剤層付き積層体であって、前記接着剤層はカルボキシル基含有スチレン系エラストマー(A)とエポキシ樹脂(B)とを所定量含有する接着剤組成物からなり、かつ、Bステージ状であり、接着剤層の厚さが基材フィルムの厚さより厚く、正方形状の接着剤層付き積層体を、接着剤層を上にして水平面上に載置したときに、積層体の端部の浮き上がり高さ(H)と積層体の一辺の長さ(L)との比(H/L)が0.05未満であることを特徴とする接着剤層付き積層体。【選択図】なし |
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