Pb-FREE Bi SOLDER ALLOY, ELECTRONIC COMPONENT PREPARED WITH THE SAME, AND ELECTRONIC COMPONENT-MOUNTING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a Pb-free Bi solder alloy that can form a solder joint with sufficient joining strength, even when used for joining to a joined member containing an Au layer as the outermost surface layer and an Ni layer as a ground layer.SOLUTION: The present invention provides a P...

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Bibliographische Detailangaben
1. Verfasser:	TAKAMORI MASAHITO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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