Pb-FREE Bi SOLDER ALLOY, ELECTRONIC COMPONENT PREPARED WITH THE SAME, AND ELECTRONIC COMPONENT-MOUNTING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a Pb-free Bi solder alloy that can form a solder joint with sufficient joining strength, even when used for joining to a joined member containing an Au layer as the outermost surface layer and an Ni layer as a ground layer.SOLUTION: The present invention provides a P...

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Bibliographische Detailangaben
1. Verfasser:	TAKAMORI MASAHITO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a Pb-free Bi solder alloy that can form a solder joint with sufficient joining strength, even when used for joining to a joined member containing an Au layer as the outermost surface layer and an Ni layer as a ground layer.SOLUTION: The present invention provides a Pb-free Bi solder alloy that contains Bi as a main component, and contains Ag of 0.1 mass% or more and 11.0 mass% or less and Sn of 3.0 mass% or more and 30.0 mass% or less, with the balance being Bi except inevitable impurities.SELECTED DRAWING: Figure 1 【課題】最表面層としてのＡｕ層及び下地層としてのＮｉ層を含有する被接合部材との接合に用いた場合においても、十分な接合強度のはんだ接合部を形成することができるＰｂフリーＢｉ系はんだ合金を提供することを目的とする。【解決手段】Ｂｉを主成分とし、Ａｇを０．１質量％以上１１．０質量％以下、Ｓｎを３．０質量％以上３０．０質量％以下含有し、残部が不可避不純物を除いてＢｉからなることを特徴とするＰｂフリーＢｉ系はんだ合金を提供する。【選択図】図１