JOINT DEVICE AND JOINT SYSTEM
PROBLEM TO BE SOLVED: To restrain distortion of a substrate after being jointed.SOLUTION: A joint device includes a first holding part, a second holding part, and a striker. The first holding part suctions and holds a first substrate from above. The second holding part is placed below the first hold...
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| creator | SUGIHARA SHINTARO WADA NORIO |
| description | PROBLEM TO BE SOLVED: To restrain distortion of a substrate after being jointed.SOLUTION: A joint device includes a first holding part, a second holding part, and a striker. The first holding part suctions and holds a first substrate from above. The second holding part is placed below the first holding part, and suctions and holds a second substrate from below. The striker presses a central part of the first substrate from above, and brings into contact with the second substrate. The first holding part has multiple suction areas sectioned concentrically around a position facing the central part of the first substrate. Multiple suction areas include an outer peripheral suction area for suctioning and holding the outer periphery of the first substrate. The outer peripheral suction areas are arranged at 90° intervals in a hoop direction, and include four first suction areas subjected to batch control, and more than three second suction areas arranged at both ends of the four first suction areas in the hoop direction, and subjected to the batch control.SELECTED DRAWING: Figure 10
【課題】接合後の基板の歪みを抑えること。【解決手段】本実施形態に係る接合装置は、第１保持部と、第２保持部と、ストライカーとを備える。第１保持部は、第１基板を上方から吸着保持する。第２保持部は、第１保持部の下方に配置され、第２基板を下方から吸着保持する。ストライカーは、第１基板の中心部を上方から押圧して第２基板に接触させる。また、第１保持部は、第１基板の中心部に対向する位置を中心に同心円状に区画された複数の吸着領域を有する。複数の吸着領域は、第１基板の外周部を吸着保持する外周吸着領域を含む。外周吸着領域は、周方向に９０°間隔で配置され、一括制御される４つの第１吸着領域と、４つの第１吸着領域の周方向両端に配置され、一括制御される４つ以上の第２吸着領域とを含む。【選択図】図１０ |
| format | Patent |
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【課題】接合後の基板の歪みを抑えること。【解決手段】本実施形態に係る接合装置は、第１保持部と、第２保持部と、ストライカーとを備える。第１保持部は、第１基板を上方から吸着保持する。第２保持部は、第１保持部の下方に配置され、第２基板を下方から吸着保持する。ストライカーは、第１基板の中心部を上方から押圧して第２基板に接触させる。また、第１保持部は、第１基板の中心部に対向する位置を中心に同心円状に区画された複数の吸着領域を有する。複数の吸着領域は、第１基板の外周部を吸着保持する外周吸着領域を含む。外周吸着領域は、周方向に９０°間隔で配置され、一括制御される４つの第１吸着領域と、４つの第１吸着領域の周方向両端に配置され、一括制御される４つ以上の第２吸着領域とを含む。【選択図】図１０</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180920&DB=EPODOC&CC=JP&NR=2018147944A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180920&DB=EPODOC&CC=JP&NR=2018147944A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUGIHARA SHINTARO</creatorcontrib><creatorcontrib>WADA NORIO</creatorcontrib><title>JOINT DEVICE AND JOINT SYSTEM</title><description>PROBLEM TO BE SOLVED: To restrain distortion of a substrate after being jointed.SOLUTION: A joint device includes a first holding part, a second holding part, and a striker. The first holding part suctions and holds a first substrate from above. The second holding part is placed below the first holding part, and suctions and holds a second substrate from below. The striker presses a central part of the first substrate from above, and brings into contact with the second substrate. The first holding part has multiple suction areas sectioned concentrically around a position facing the central part of the first substrate. Multiple suction areas include an outer peripheral suction area for suctioning and holding the outer periphery of the first substrate. The outer peripheral suction areas are arranged at 90° intervals in a hoop direction, and include four first suction areas subjected to batch control, and more than three second suction areas arranged at both ends of the four first suction areas in the hoop direction, and subjected to the batch control.SELECTED DRAWING: Figure 10
【課題】接合後の基板の歪みを抑えること。【解決手段】本実施形態に係る接合装置は、第１保持部と、第２保持部と、ストライカーとを備える。第１保持部は、第１基板を上方から吸着保持する。第２保持部は、第１保持部の下方に配置され、第２基板を下方から吸着保持する。ストライカーは、第１基板の中心部を上方から押圧して第２基板に接触させる。また、第１保持部は、第１基板の中心部に対向する位置を中心に同心円状に区画された複数の吸着領域を有する。複数の吸着領域は、第１基板の外周部を吸着保持する外周吸着領域を含む。外周吸着領域は、周方向に９０°間隔で配置され、一括制御される４つの第１吸着領域と、４つの第１吸着領域の周方向両端に配置され、一括制御される４つ以上の第２吸着領域とを含む。【選択図】図１０</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD18vf0C1FwcQ3zdHZVcPRzUYAIBEcGh7j68jCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeK8AIwNDC0MTc0sTE0djohQBAMfaIXg</recordid><startdate>20180920</startdate><enddate>20180920</enddate><creator>SUGIHARA SHINTARO</creator><creator>WADA NORIO</creator><scope>EVB</scope></search><sort><creationdate>20180920</creationdate><title>JOINT DEVICE AND JOINT SYSTEM</title><author>SUGIHARA SHINTARO ; WADA NORIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2018147944A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>SUGIHARA SHINTARO</creatorcontrib><creatorcontrib>WADA NORIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUGIHARA SHINTARO</au><au>WADA NORIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>JOINT DEVICE AND JOINT SYSTEM</title><date>2018-09-20</date><risdate>2018</risdate><abstract>PROBLEM TO BE SOLVED: To restrain distortion of a substrate after being jointed.SOLUTION: A joint device includes a first holding part, a second holding part, and a striker. The first holding part suctions and holds a first substrate from above. The second holding part is placed below the first holding part, and suctions and holds a second substrate from below. The striker presses a central part of the first substrate from above, and brings into contact with the second substrate. The first holding part has multiple suction areas sectioned concentrically around a position facing the central part of the first substrate. Multiple suction areas include an outer peripheral suction area for suctioning and holding the outer periphery of the first substrate. The outer peripheral suction areas are arranged at 90° intervals in a hoop direction, and include four first suction areas subjected to batch control, and more than three second suction areas arranged at both ends of the four first suction areas in the hoop direction, and subjected to the batch control.SELECTED DRAWING: Figure 10
【課題】接合後の基板の歪みを抑えること。【解決手段】本実施形態に係る接合装置は、第１保持部と、第２保持部と、ストライカーとを備える。第１保持部は、第１基板を上方から吸着保持する。第２保持部は、第１保持部の下方に配置され、第２基板を下方から吸着保持する。ストライカーは、第１基板の中心部を上方から押圧して第２基板に接触させる。また、第１保持部は、第１基板の中心部に対向する位置を中心に同心円状に区画された複数の吸着領域を有する。複数の吸着領域は、第１基板の外周部を吸着保持する外周吸着領域を含む。外周吸着領域は、周方向に９０°間隔で配置され、一括制御される４つの第１吸着領域と、４つの第１吸着領域の周方向両端に配置され、一括制御される４つ以上の第２吸着領域とを含む。【選択図】図１０</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | JOINT DEVICE AND JOINT SYSTEM |
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