JOINT DEVICE AND JOINT SYSTEM

PROBLEM TO BE SOLVED: To restrain distortion of a substrate after being jointed.SOLUTION: A joint device includes a first holding part, a second holding part, and a striker. The first holding part suctions and holds a first substrate from above. The second holding part is placed below the first hold...

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Bibliographische Detailangaben
Hauptverfasser: SUGIHARA SHINTARO, WADA NORIO
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To restrain distortion of a substrate after being jointed.SOLUTION: A joint device includes a first holding part, a second holding part, and a striker. The first holding part suctions and holds a first substrate from above. The second holding part is placed below the first holding part, and suctions and holds a second substrate from below. The striker presses a central part of the first substrate from above, and brings into contact with the second substrate. The first holding part has multiple suction areas sectioned concentrically around a position facing the central part of the first substrate. Multiple suction areas include an outer peripheral suction area for suctioning and holding the outer periphery of the first substrate. The outer peripheral suction areas are arranged at 90° intervals in a hoop direction, and include four first suction areas subjected to batch control, and more than three second suction areas arranged at both ends of the four first suction areas in the hoop direction, and subjected to the batch control.SELECTED DRAWING: Figure 10 【課題】接合後の基板の歪みを抑えること。【解決手段】本実施形態に係る接合装置は、第1保持部と、第2保持部と、ストライカーとを備える。第1保持部は、第1基板を上方から吸着保持する。第2保持部は、第1保持部の下方に配置され、第2基板を下方から吸着保持する。ストライカーは、第1基板の中心部を上方から押圧して第2基板に接触させる。また、第1保持部は、第1基板の中心部に対向する位置を中心に同心円状に区画された複数の吸着領域を有する。複数の吸着領域は、第1基板の外周部を吸着保持する外周吸着領域を含む。外周吸着領域は、周方向に90°間隔で配置され、一括制御される4つの第1吸着領域と、4つの第1吸着領域の周方向両端に配置され、一括制御される4つ以上の第2吸着領域とを含む。【選択図】図10