PROBER

PROBLEM TO BE SOLVED: To provide a prober with which it is possible to reduce stray inductance from a chip reverse side electrode to a test connection point.SOLUTION: The prober comprises: a wafer chuck 18 having an electroconductive support surface 18a; a probe card 24 having a plurality of probes...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TERADA SHOJI, AKEBOSHI TOMOYUKI, MURAKAMI KONOSUKE, SHIGESAWA YUJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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