METHOD FOR PRODUCING METAL/CERAMIC CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a method for producing a metal/ceramic circuit board which can sufficiently suppress the occurrence of migration, in which a metal plate is bonded to a ceramic substrate by means of an active metal-containing brazing filler metal.SOLUTION: After a copper plate 14 is bonded to at least one surface of a ceramic substrate 10 via an active metal-containing brazing filler metal 12 which contains silver, unnecessary portions of the copper plat 14 and active metal containing brazing filler metal 12 is removed, and thereafter, an unnecessary portion of the copper plate 14 is removed by chemical polishing so as to cause the active metal-containing brazing filler metal 12 to protrude from a side face portion of the copper plate 14, and then, a silver layer 18 adhered to the surface of the copper plate 14 is removed by the chemical polishing.SELECTED DRAWING: Figure 1G 【課題】活性金属含有ろう材によりセラミックス基板に金属板を接合した金属−セラミックス回路基板の製造方法において、マイグレーションの発生を十分に抑制することができる金属−セラミックス回路基板を製造することができる方法の提供。【解決手段】セラミックス基板１０の少なくとも一方の面に、銀を含む活性金属含有ろう材１２を介して銅板１４を接合した後、銅板１４と活性金属含有ろう材１２の不要部分を除去し、その後、化学研磨により銅板１４の側面部から活性金属含有ろう材１２がはみ出すように銅板１４の不要部分を除去し、この化学研磨によって銅板１４の表面に付着した銀層１８を除去する金属−セラミックス回路基板の製造方法。【選択図】図１Ｇ