SOLDER JOINT DEVICE

PROBLEM TO BE SOLVED: To provide a solder joint device which can solder an electronic component to an electrode formed on a substrate while carrying the substrate mounted with the electronic component, by using induction heat.SOLUTION: A solder joint device includes: carrying means 12 which carries a substrate 11 mounted with an electronic component C; and heating means which melts solder interposed between an electrode 13 and the electronic component, thereby soldering the electronic component to the electrode. The heating means has a coil 20 which has a space portion inside; a plurality of ferrite 30 aligned in a carrying direction of the substrate in the space portion of the coil; an adjusting mechanism 40 which adjusts an interval between each ferrite and the electrode formed on the substrate; and a power supply 50 which applies Ac voltage to the coil to heat the electrode formed on the substrate.SELECTED DRAWING: Figure 1 【課題】誘導加熱を利用して、電子部品を搭載した基板を搬送しながら、基板上に形成された電極に、電子部品を生産良く半田接合することができる半田接合装置を提供する。【解決手段】本発明の半田接合装置は、電子部品Ｃを搭載した基板１１を搬送する搬送手段１２と、電極１３と電子部品との間に介在させた半田を溶融させて、電極に電子部品を半田接合する加熱手段とを備え、加熱手段は、内側に空間部を有するコイル２０と、コイルの空間部に基板の搬送方向に沿って配列された複数のフェライト３０と、各フェライトと基板上に形成された電極との間隔を独立に調整する調整機構４０と、コイルに交流電圧を印加して基板上に形成された電極を誘導加熱する電源５０とを有している。【選択図】図１