CERAMIC SPUTTERING TARGET AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a ceramic sputtering target and a manufacturing method of the same, the ceramic sputtering target being made of ceramic such as an oxide and reducing a number of particles generated during sputtering.SOLUTION: A ceramic sputtering target has a part 2 which is to be s...

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Bibliographische Detailangaben
Hauptverfasser: SAIDO YOSHIYUKI, SHIBAYAMA TAKASANE
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a ceramic sputtering target and a manufacturing method of the same, the ceramic sputtering target being made of ceramic such as an oxide and reducing a number of particles generated during sputtering.SOLUTION: A ceramic sputtering target has a part 2 which is to be sputtered in a sputtering surface side and provided with a mirror processing to have the sputtered part 2 with an arithmetic average roughness Ra of 0.03 μm or less, and has parts 3 and 4 which are not sputtered and have an arithmetic average roughness of 0.2 μm or more. A sputtering target like this reduces a number of particles during sputtering because the part 2 to be sputtered in the sputtering surface side is a smooth surface with a small surface roughness and the parts 3, 4 not to be sputtered in the sputtering surface side have a relatively larger surface roughness.SELECTED DRAWING: Figure 1 【課題】スパッタ中に発生するパーティクル数が低減される酸化物等のセラミックス製スパッタリングターゲット及びその製造方法を提供する。【解決手段】スパッタ面側のスパッタされる部分2に鏡面加工を施すことにより、該スパッタされる部分2の算術平均粗さRaが0.03μm以下とし、スパッタ面側のスパッタされない部分3,4の算術平均粗さRaが0.2μm以上としたセラミックス製スパッタリングターゲット。このようなスパッタリングターゲットでは、スパッタ面側のスパッタされる部分2が表面粗度の小さな平滑な面であり、スパッタ面側のスパッタされない部分3,4が表面粗度の比較的大きな面であるため、スパッタリング中のパーティクル数が低減する。【選択図】図1