LIGHT-EMITTING ELEMENT PACKAGE

PROBLEM TO BE SOLVED: To improve the light extraction efficiency of a light-emitting element package.SOLUTION: Disclosed is a light-emitting element package which is improved in the light extraction efficiency. The light-emitting element package according to an embodiment includes: a substrate: a li...

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Bibliographische Detailangaben
Hauptverfasser:	KIM BYUNG MOK, TANDA YUICHIRO, KODAIRA HIROSHI, OZEKI SOJI, KIM HA NA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve the light extraction efficiency of a light-emitting element package.SOLUTION: Disclosed is a light-emitting element package which is improved in the light extraction efficiency. The light-emitting element package according to an embodiment includes: a substrate: a light-emitting element located on the substrate; a light transmitting part which is located spaced apart from the light-emitting element in the upper part of the light-emitting element. A distance between the upper surface of the light-emitting element and the light transmitting part is 0.15 mm to 0.35 mm.SELECTED DRAWING: Figure 1 【課題】発光素子パッケージの光抽出効率を向上させること。【解決手段】光抽出効率が向上した発光素子パッケージが開示される。実施形態に係る発光素子パッケージは、基板と；前記基板上に位置する発光素子と；前記発光素子の上部に、発光素子と離隔して位置する光透過部と；を含み、前記発光素子の上面と前記光透過部との間の距離が０．１５ｍｍ乃至０．３５ｍｍである。【選択図】図１