ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide an electronic device in which influence of heat of getter activation on an electronic component can be reduced, even when a getter is provided in a package.SOLUTION: The electronic device is provided that comprises; a substrate; a lid portion joined to the substrate; and an electronic component, a getter, and a getter heating part which are each accommodated in an accommodation space constituted of the substrate and the lid portion, the lid portion includes a first layer and a second layer on the side of the accommodation space of the first layer. The electronic device satisfies λ1>λ2 when λ1 denotes the thermal conductivity of the first layer, and λ2 denotes the thermal conductivity of the second layer.SELECTED DRAWING: Figure 1 【課題】パッケージ内にゲッターを備えていても、ゲッター活性化の熱に対して電子部品への熱影響が低減可能な電子デバイスを提供することを目的とする。【解決手段】基板と、前記基板に接合される蓋部と、前記基板と、前記蓋部と、により構成される収容空間に、電子部品と、ゲッターと、ゲッター加熱部と、を収容した電子デバイスであって、前記蓋部は、第１の層と、前記第１の層の前記収容空間側に第２の層と、を含み、前記第１の層の熱伝導率をλ１、前記第２の層の熱伝導率をλ２、とし、λ１＞λ２、である電子デバイス。【選択図】図１