MULTILAYER PRINTED BOARD AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a multilayer printed board having a conductor pattern uniform in thickness, which is embedded in an insulator layer.SOLUTION: The multilayer printed board includes: an inner layer base plate 2; a first conductor pattern 31 formed on the surface of the inner layer base plate 2; a first insulator layer 41 formed over the surface of the inner layer base plate 2 covering the first conductor pattern 31; a second insulator layer 42 formed over the surface of the first insulator layer 41; a second conductor pattern 32 formed in a portion of the surface of the first insulator layer 41, where the second insulator layer 42 is not formed; and a via hole 5 penetrating the first insulator layer 41 to electrically connect the first conductor pattern 31 to the second conductor pattern 32.SELECTED DRAWING: Figure 1 【課題】絶縁層に埋め込まれた導体パターンの厚さが均一な多層プリント配線板を提供する。【解決手段】内層基板２と、内層基板２の表面に形成された第１導体パターン３１と、第１導体パターン３１を覆うように内層基板２の表面に形成された第１絶縁層４１と、第１絶縁層４１の表面に形成された第２絶縁層４２と、第１絶縁層４１の表面において第２絶縁層４２が形成されていない部分に形成された第２導体パターン３２と、第１絶縁層４１を貫通して第１導体パターン３１と第２導体パターン３２とを電気的に接続するビアホール５と、を備えている。【選択図】図１