POWDER SINTERED LAMINATED MOLDING APPARATUS AND POWDER SINTERED LAMINATED MOLDING METHOD

PROBLEM TO BE SOLVED: To provide a powder sintered laminated molding apparatus and a powder sintered laminated molding method for reducing a thickness of a buffer layer of a powder material formed on a shaping table before starting production of a shaped object.SOLUTION: It has a shaping table 11, a...

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1. Verfasser: SAKAGAMI MASAHIKO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a powder sintered laminated molding apparatus and a powder sintered laminated molding method for reducing a thickness of a buffer layer of a powder material formed on a shaping table before starting production of a shaped object.SOLUTION: It has a shaping table 11, a heat insulating member 15 which is disposed on the shaping table 11 and has a flat top surface and has a heat insulating property, and a heating means 130, 140 for heating a layer of a powder material 70 formed on the heat insulating member 15.SELECTED DRAWING: Figure 2 【課題】造形物の作製を開始する前に造形用テーブルの上に形成する粉末材料のバッファ層の厚さを薄くする粉末焼結積層造形装置及び粉末焼結積層造形方法を提供すること。【解決手段】造形用テーブル11と、造形用テーブル11の上に配置され、上面が平坦な断熱性を有する断熱部材15と、断熱部材15の上に形成された粉末材料70の層を加熱する加熱手段130,140とを有する。【選択図】図2