ENCAPSULATION MATERIAL, WLP STRUCTURE OPTICAL SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide an encapsulation material that can increase luminance of an optical semiconductor device manufactured from a wafer level package (WLP).SOLUTION: An encapsulation material (a white encapsulation layer 50) is used for encapsulation of an optical semiconductor element 1...

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Hauptverfasser:	INABA TAKAKAZU, YAMADA KAZUHIKO, MATSUZAKI TAKAYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an encapsulation material that can increase luminance of an optical semiconductor device manufactured from a wafer level package (WLP).SOLUTION: An encapsulation material (a white encapsulation layer 50) is used for encapsulation of an optical semiconductor element 10 in a wafer level package (WLP) structure, and contains a white pigment, and is liquid.SELECTED DRAWING: Figure 3 【課題】ウェハレベルパッケージ（ＷＬＰ）から作製される光半導体装置の高輝度化を可能とする封止材を提供すること。【解決手段】封止材（白色封止層５０）は、ウェハレベルパッケージ（ＷＬＰ）構造における光半導体素子１０の封止に用いられる封止材であって、白色顔料を含み、液状である。【選択図】図３