SUPPORT DEVICE, EXPOSURE EQUIPMENT AND MANUFACTURING METHOD OF ARTICLE

PROBLEM TO BE SOLVED: To provide a support device advantageous for a structure to support an object.SOLUTION: A support device includes: a structure 6 including an upper face and a lower face for supporting an object; a support member 5 supporting the structure at plural points; and a vibration-isol...

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Bibliographische Detailangaben
1. Verfasser:	ASANO TOSHIYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS BLASTING CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING HOLOGRAPHY LIGHTING MATERIALS THEREFOR MEANS FOR DAMPING VIBRATION MECHANICAL ENGINEERING ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SHOCK-ABSORBERS SPRINGS THERMAL INSULATION IN GENERAL WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a support device advantageous for a structure to support an object.SOLUTION: A support device includes: a structure 6 including an upper face and a lower face for supporting an object; a support member 5 supporting the structure at plural points; and a vibration-isolating mount 4 supporting the support member 5 at plural points. The support member 5 supports the structure 6 between the upper face and the lower face. The points of support for structure 6 by the support member 5 are located more inward than the points of support for the support member 5 by the vibration-isolating mount 4.SELECTED DRAWING: Figure 1 【課題】構造体が対象物を支持するのに有利な支持装置を提供する。【解決手段】対象物を支持するための上面及び下面を含む構造体６と、前記構造体を複数点で支持する支持部材５と、前記支持部材５を複数点で支持する除振マウント４と、を有し、前記支持部材５は、前記上面と前記下面との間で前記構造体６を支持し、前記支持部材５による前記構造体６の支持点は、前記除振マウント４による前記支持部材５の支持点よりも内側に位置することを特徴とする支持装置。【選択図】図１