SUBSTRATE HOLDER, PLATING APPARATUS, PLATING METHOD, AND ELECTRIC CONTACT

PROBLEM TO BE SOLVED: To suppress the dispersion of contact resistances between an electric contact point and a seed layer of a substrate even when there is an insulator such as a thin film or a residue on the surface of the seed layer.SOLUTION: There is provided a substrate holder to hold a substrate. The substrate holder comprises: a first holding member having a surface configured so as to contact the substrate; and a second holding member for sandwiching and holding the substrate with the help of the first holding member. The second holding member includes: a removal part, which is placed so as to follow the outer periphery of the substrate when the substrate is sandwiched by the first and second holding members, and which is configured so as to remove an insulator on the substrate while contacting the substrate; and an electric contact part, which is placed so as to follow the outer periphery of the substrate and is configured so as to contact the region on the substrate after the removal part removes the insulator when the first and second holding members sandwich the substrate. The removal part is positioned in the vicinity of the surface nearer than the electric contact part when the first holding member is placed opposite to the second holding member.SELECTED DRAWING: Figure 5A 【課題】基板のシード層表面に薄膜や残渣等の絶縁物が存在する場合であっても、電気接点とシード層との間の接触抵抗のバラつきを抑制する。【解決手段】基板を保持するための基板ホルダが提供される。この基板ホルダは、基板と接触するように構成される面を有する第１保持部材と、第１保持部材と共に基板を挟み込んで保持する第２保持部材と、を有する。第２保持部材は、第１保持部材と第２保持部材とで基板を挟み込んだときに基板の外周に沿うように配置され、且つ基板に接触して基板上の絶縁物を除去するように構成される除去部と、第１保持部材と第２保持部材とで基板を挟み込んだときに、基板の外周に沿うように配置され且つ除去部が絶縁物を除去した基板上の領域に接触するように構成される電気接点部と、を有する。除去部は、第１保持部材と第２保持部材とを対向して配置させたときに、電気接点部よりも前記面の近くに位置する。【選択図】図５Ａ