PLASMA CVD DEVICE AND FILM DEPOSITION METHOD

PROBLEM TO BE SOLVED: To reduce costs in a plasma CVD device for applying film deposition treatment to inner faces of plural containers.SOLUTION: A plasma CVD device comprises: a high frequency power source 31; an automatic matching unit 23 electrically connected to a high frequency power source 31; a switcher 22 electrically connected to the automatic matching unit 23; a first electrode 3 and a second electrode 33 electrically connected to the switcher 22; a first container 7 arranged inside the first electrode 3; a second container arranged inside the second electrode 33; a gas supply mechanism 19 for supplying raw material gas into the first and second containers; and a vacuum evacuation mechanism 21 for vacuum-evacuating the first container 7 and the second container. The switcher 22 has a first path electrically connected to the automatic matching unit 23 and the first electrode 3, and a second path electrically connected to the automatic matching unit 23 and the second electrode 33.SELECTED DRAWING: Figure 3 【課題】複数の容器の内面に成膜処理を行うプラズマＣＶＤ装置におけるコストの低減。【解決手段】高周波電源３１と、高周波電源３１に電気的に接続された自動整合器２３と、自動整合器２３に電気的に接続された切替器２２と、切替器２２に電気的に接続された第１の電極３及び第２の電極３３と、第１の電極３の内側に配置された第１の容器７と、第２の電極３３の内側に配置された第２の容器と、前記第１の容器内及び前記第２の容器内に原料ガスを供給するガス供給機構１９と、第１の容器７内及び前記第２の容器内を真空排気する真空排気機構２１と、を具備し、切替器２２は、自動整合器２３と第１の電極３とを電気的に接続する第１の経路と、自動整合器２３と第２の電極３３とを電気的に接続する第２の経路を有するプラズマＣＶＤ装置。【選択図】図３