RESIN COMPOSITION AND MOLDING PREPARED WITH THE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a resin composition containing an ultrahigh-molecular-weight polyethylene resin, where the resin composition can be molded in much the same fashion as the general-purpose polyethylene without impairing excellent properties from the ultrahigh-molecular-weight polyethy...

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Bibliographische Detailangaben
Hauptverfasser: HAMAGUCHI KIYOTAKA, MORI TOYOICHIRO, ARITOME NORIFUMI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a resin composition containing an ultrahigh-molecular-weight polyethylene resin, where the resin composition can be molded in much the same fashion as the general-purpose polyethylene without impairing excellent properties from the ultrahigh-molecular-weight polyethylene resin.SOLUTION: A resin composition contains an ultrahigh-molecular-weight polyethylene resin (A) with a viscosity average molecular weight of 300,000 or more, and condensed hydroxy fatty acid and/or alcohol ester thereof (B). The resin composition contains a resin (C) other than the ultrahigh-molecular-weight polyethylene resin (A), and the resin (C) is an olefinic resin.SELECTED DRAWING: None 【課題】超高分子量ポリエチレン系樹脂を含む樹脂組成物であって、超高分子量ポリエチレン系樹脂由来の優れた特性を損なうことなく、汎用ポリエチレン同様の方法により成形し得る樹脂組成物の提供。【解決手段】粘度平均分子量が30万以上の超高分子量ポリエチレン系樹脂(A)と、縮合ヒドロキシ脂肪酸および/またはそのアルコールエステル(B)とを含む樹脂組成物。上記樹脂組成物が、超高分子量ポリエチレン系樹脂(A)以外の樹脂(C)を含み、該樹脂(C)が、オレフィン系樹脂である。【選択図】なし