RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED BOARD AND SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a resin composition that has excellent coating properties and heat resistance, and markedly excellent developability, and a resin sheet with a support, and a multilayer printed board and a semiconductor device using the same.SOLUTION: A resin composition contains a n...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a resin composition that has excellent coating properties and heat resistance, and markedly excellent developability, and a resin sheet with a support, and a multilayer printed board and a semiconductor device using the same.SOLUTION: A resin composition contains a naphthalene type epoxy resin of (1), a photocuring initiator, a compound of (2), and a compound having an ethylenically unsaturated group other than the compound of formula (2).SELECTED DRAWING: None
【課題】塗膜性及び耐熱性に優れ、現像性に大変優れる樹脂組成物、支持体付き樹脂シート、それらを用いた多層プリント配線板、半導体装置。【解決手段】(1)のナフタレン型エポキシ樹脂、光硬化開始剤、(2)の化合物、式(2)の化合物以外のエチレン性不飽和基を有する化合物を含む樹脂組成物。【選択図】なし |
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