SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method capable of cleaning a substrate well by using a physical force, while suppressing damage to the substrate.SOLUTION: A process liquid nozzle 6 of a substrate processing apparatus 1 includes a body 22 in which a cylindrical space 21 is formed, and a first physical force imparting unit 23 attached to the body 22, and imparting a physical force to the liquid level of the process liquid stored in the cylindrical space 21. In a state where the process liquid nozzle 6 is facing the upper surface of a substrate W closely, the process liquid is supplied to the cylindrical space 21. Consequently, a liquid column 46 including a first liquid column part 41 and a second liquid column part 42 is formed on the upper surface of the substrate W. The first liquid column part fills between a lower opening 21b of the cylindrical space 21 and the upper surface of the substrate W with the process liquid fluid-tightly. The second liquid column part 42 is continuous upward from the first liquid column part 41, and consists of the process liquid stored in the cylindrical space 21.SELECTED DRAWING: Figure 3 【課題】基板へのダメージを抑制しながら、物理力を用いて基板を良好に洗浄することができる基板処理装置および基板処理方法を提供する。【解決手段】基板処理装置１に係る処理液ノズル６は、筒状空間２１が内部に形成されたボディ２２と、ボディ２２に取り付けられて、筒状空間２１に溜められている処理液の液面に物理力を付与する第１の物理力付与ユニット２３とを含む。処理液ノズル６を基板Ｗの上面に近接して対向させた状態で、筒状空間２１に処理液が供給される。これにより、基板Ｗの上面に、第１の液柱部分４１および第２の液柱部分４２を含む処理液の液柱４６が形成される。第１の液柱部分は、筒状空間２１の下部開口２１ｂと基板Ｗの上面との間を処理液で液密に満たす。第２の液柱部分４２は、第１の液柱部分４１から上方に連なり、筒状空間２１に溜められた処理液からなる。【選択図】図３